3D Ultra-Deep Field Laser Blind Via Automatic Measuring Instrument: A precision microscopy instrument integrating optical imaging, digital image processing and 3D reconstruction technologies. It breaks through the depth of field limitation of traditional optical microscopes to achieve high-definition observation and measurement of complex 3D structures. It can observe laser via diameter, depth and residual glue of PCB and FPC, measure roundness and copper plating depression, and support conventional PCB section observation and measurement.

1. Fully Automated Testing Process: Place sample > Enter product information with barcode scanner > Query engineering data to obtain measurement information & judgment specifications > Locate and perform 3D topography scanning > Automatically measure and count topography data > Generate dedicated report > Test results
2. Large gantry-type main body with Grade 00 marble platform design to ensure precision stability.
3. X.Y linear motor drive ensures high-speed movement and high positioning accuracy, as well as precise positioning under high magnification.
4. Adopts Olympus (Japan) optical system with bright field, dark field, polarized light and other optical systems, equipped with: 5X, 10X, 20X, 50X bright/dark field objective lenses, electronic magnification: 60-1500X.
5. Adopts high-definition video imaging system: German 5-megapixel high-definition digital camera: Sensor: 2/3" large-format CMOS sensor, meeting the requirements of high-speed 3D scanning imaging with high-quality imaging.
6. 2D and 3D intelligent stitching to set the shooting range; the microscope automatically realizes large-range 2D stitching positioning learning and one-click 3D scanning of large field of view.
7. Z-axis working stroke: 50mm, Z accuracy: Under 20X objective lens: The accuracy of 2 ceramic standard gauge blocks is ≤1.5μm.
8. Working stroke: 750×650×50mm, customizable size and MES upload available.