The high and low temperature thermal shock test chamber is mainly used to test the resistance of materials to extremely high or extremely low temperatures. The thermal shock test enables various items to complete the test in the shortest time. Changes or physical damage caused by thermal shock are induced by thermal expansion and contraction changes or other physical property changes. The adoption of a PID system ensures complete reliability for all types of products. The effects of thermal shock include electrochemical changes caused by cracking, delamination, displacement, etc. of finished products. It is an essential testing equipment for material industries such as PCB, FPC, metal, plastic, rubber, and electronics. It is divided into two-chamber type and three-chamber type, with differences in test methods and internal structures. The product complies with the requirements of the following standards: GB/T2423.1-2008 Test A, GB/T2423.2-2008 Test B, GB-T10592-2008, GJB150.3-198, GJB360A-96 Method 107 Temperature Shock Test. The test methods met: GJB150.5-86 Temperature Shock Test, complying with MIL, IEC, JIS specifications, military standard GJB150.3-86; military standard GJB150.4-86; military standard GJB150.5-86.

1. Temperature shock range of test chamber: High temperature chamber: +50℃～180℃ Low temperature chamber: 0℃～-55℃
2. Temperature fluctuation: ±1℃;
3. Temperature error: ±1℃;
4. Heating rate: From room temperature to 180℃ ≤ 30 min;
5. Cooling rate: From room temperature to -55°C ≤ 60 min;
6. Power supply: 380V±38V 50Hz±1Hz
7. Power: About 18Kw, basket load capacity: Within 20Kg.
8. Refrigeration compressor: Imported brand. Air supply circulation system: Adopts Japanese-made multi-wing centrifugal circulation fan and complete set of Japanese-made motor
9. Inner cavity volume: Customizable.